| Winland’s manufacturing
methodology is based on continuous flow manufacturing (CFM)
methods. Our CFM-driven processes eliminate product queues
and waste, and reduce cycle times and costs, while giving
Winland greater scheduling flexibility and a higher degree
of manufacturing excellence.
Winland specializes in combining both surface-mount
(SMT) and through-hole (THT) technologies into the same assembly,
and CFM helps us do it very efficiently. Our kanban point-of
use material delivery and floor stocking system puts components
close to the point where they’re incorporated into assemblies.
Work centers are arranged for the smooth transition of materials.
Winland manufacturing engineers drive customer cost savings
by carefully balancing line speeds and cycle times to increase
throughput and reduce wasteful handling.
Our manufacturing capabilities include:
- Surface-mount technology, including Ball
Grid Array (BGA), µBGA, 0402, and Chip Scale Packages
(CSP)
- Through-hole assembly; radial and axial
leaded components
- Mixed technology
- Environmental encapsulation
- Higher-level assembly and box build
- In-circuit testing and final product functional
testing
- Automated Optical Inspection (AOI)
- In-process x-ray inspection
- Test and assembly fixture design and development
- Retrofit and product modification
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