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Winland is positioned to deliver on all
your product needs, from electronics design to complete assembly,
including:
- Surface-mount technology (SMT), including Ball Grid Array
(BGA), µBGA, 0402, and Chip Scale Packages (CSP)
- Through-hole assembly; radial and axial leaded components
- Mixed technology
- Environmental encapsulation
- Higher-level assembly and box build
- In-circuit testing and final product functional testing
- Automated Optical Inspection (AOI)
- In-process x-ray inspection
- Test and assembly fixture design and development
- Retrofit and product modification
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